High-Performance Edge-Emitting Laser (EEL) Chips

UOC's edge-emitting laser diode (EEL) bare chips feature an advanced strained quantum well structure, delivering high electro-optical conversion efficiency, low operating current, and exceptional long-term reliability. Optimized top and bottom metallization ensures robust electrical contact, seamless die bonding, and dependable wire bonding. Furthermore, precision-engineered anti-reflection (AR) and high-reflection (HR) facet coatings protect laser facets, optimize cavity performance, and maximize output power, efficiency, and device lifetime.

 

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Wavelength band (nm) Model No. Po (mW) Ith (mA) Iop (mA) SE (W/A) θ// (°) θ⊥ (°) Chip size (um)
635 U-CP-63051B3 5 24 33 0.55 7.50 33 200X300X100
650 U-CP-6505001 5 11 17 0.80 8.00 36 200X250X100
650 U-CP-6505021 5 11 17 0.80 8.00 36 250X300X100
650 U-CP-65300A1 30 35 65 1.00 8.00 28 250X500X100
660 U-CP-66A00G6 100 50 140 1.05 12.00 23 200X1000X100
808 U-CP-8020021 20 8 25 1.10 7.00 27 250X300X100
808 U-CP-80B00E5 200 52 225 1.15 10.00 28 200X500X100
808 U-CP-80E0065 500 75 510 1.15 11.00 28 300X500X100
830 U-CP-83A00A5 100 17 120 1.00 10.00 18 250X500X100
980 U-CP-9850081 50 12 70 0.80 9.00 35 250X400X100
980 U-CP-98A0081 100 35 135 1.00 8.00 32 250X400X100
1310 U-CP-1305013p 5 7 0.40 22.00 34 250X250X110
Model No. Junction Capacitance(pF) Peak Sensing Wavelength(nm) Spectrum Sensitivity(nm) Forward Voltage(V) VPD size(um)
U-PD-VS129 4 650 450~1050 1.30 420 x550

Semiconductor Laser Diodes