Packaged LD

With decades of experience in 630–1550 nm edge-emitting laser (EEL) technology, UOC provides vertically integrated semiconductor laser solutions from MOCVD epitaxy and chip fabrication to laser diode packaging. We offer high-performance packaged laser diodes, OEM/ODM manufacturing, and customized solutions for industrial, medical, sensing, and communication applications.

UNION OPTRONIC CORP.’s   Packaged Laser Diodes are with 3 main groups :
 1. TO-can Packaged Laser Diodes (TO-33, TO-56, TO-9)
 2. Chip-on-Submount (CoS) & Reflector Laser Diodes
 3. Surface-Mounted Laser Diodes (SMD LD)