UOC provides comprehensive OEM and ODM services covering MOCVD epitaxy, wafer fabrication, chip fabrication, and laser diode packaging.
MOCVD epitaxy
- Customized epitaxial growth on 2- to 4-inch substrates
Wafer fabrication
- Photolithography
- Dry and wet etching
- Passivation
- Metallization
- Wafer thinning
- Other semiconductor processes
Chip fabrication
- Bar cleaving
- Facet coating
- Dicing
- Testing
- Sorting
Laser diode packaging
- Die bonding
- Wire bonding
- Capping
- Testing
- Burn-in
