Epitaxial Process -
Flow Capacity Control,
Temperature Control, Pressure Control...
Wafer Test - CV, PL,
EL, X-ray Test
Wafer
Process
1. In Process, Check by Oneself
2. Test Before Facet Coating
3. Test After Facet Coating
4. Sorting Chip
Package Process 1. In Process Check, SPC.
2. Test After Chip on Submount
3. Test After Burn-in
Finally Quality Control
The objective of our quality policy is
to provide best service, high quality and reliability products
to our customers. Every member of U.O.C. is responsible for the
quality of his duties. With continuous improvement and innovation,
we're sincere to provide best service to our customers.