VCSEL

VCSEL

Product Type
Description
eif-wafer chips
 Wafer Size:2" in siameter
 Customer Design for Laser Structures
 Lasing Wavelength: 635nm ~ 1550nm
OEM/ODM Products:
Including: Laser/LED/Photodetector/VCSEL/RCLED structures. 		Materials Available :
GaAs, AlGaAs, InGaAlP, InP, InGaAsP, InGaAlAs...etc.
VCSEL
Modulated Procedure make most process possible. Especially suitable for LED/LD process.

PHOTO LITHGRAPHY

The ability for:
Negitive PR & Positive PR for different
thickness.
Exposing by using Contact Aligner.
PR remove by stripper.

CHEMICAL ETCH.

The ability for:
Wet selective etch. for semiconductors.
( i.e. InP, InGaAsP,GaAs,GaInP,AlGaInP,
AlGaAs...etc. )
Dry etch for GaN,AlGaN or InGaN.
DEPOSITION.

The ability for:
Metal deposition for Ti, Al, Pt, Ni, Au & its alloy. Cr. Zn... etc.
Oxide deposition for a-Si, SiO2, Si3N4, TiO2, Al2O3... etc.
Plasma deposition for SiO2, a-Si & Si3N4.
Thin films of AR or HR for any wavelength.
LAPPING & POLISHING

The ability for:
GaAs based material.
InP based material.
Al2O3 based material.
CHIPPING

The ability for:
GaAs based material.
InP based material.
Al2O3 based material
by using diamond scriber & breaker.




5.6mm TO-CAN Package for Edge Emitting Laser Chips
Both Au-Sn sorder and Indium sorder die attaching processes available.

Full-auto assembly line and testing facility ready for both short & long wavelength applications.

Hermetically sealed with flat window cap, ball lens cap, or aspherical lens cap.

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